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"DRAM
Market Forces of Fragmentation & Consolidation"
The DRAM market continues to
develop evolutionary devices, however some interesting derivatives have
found market acceptance. It's also important to review the market
failures to understand what went wrong. As speeds increase,
engineers are changing the ground rules to keep up with demand with
tricks at the device and at the system level.
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"Load Reduction Memory
Module"
The DRAM industry
is headed down a common path to produce high capacity memory modules to
replace the ill-fated Fully Buffered DIMMs. Will the LR-DIMM face
the same fate as FB-DIMM did? Has the industry learned its lesson? |
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"High Convergence: Low Cost Multi-Die
Packaging Enables Pace Setting Performance"
DRAM stacking has been around the
industry for ages, however the increased interface speeds of DRAM
interfaces has challenged memory suppliers to rethink traditional
approaches.
Invensas
has developed a variation of standard wire bonding techniques to address
this need, and in the process improved on system performance.
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"Cost-minimized
Double Die DRAM Packaging for Ultra-High Performance DDR3 and DDR4
Multi-Rank Server DIMMs"
Rethinking the DRAM stack using
standard dual wire bonding
instead of redistribution layers increases performance while avoiding
high cost.
Co-authored with R. Crisp,
W. Zohni, B. Haba,
Invensas Corp.
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